MB102 830 Point Solderless Breadboard
- 830 tie-point solderless breadboard
- Standard 2.54 mm (0.1 inch) pitch
- 630 tie points in the main terminal area
- 200 tie points in power distribution rails
- 4 power rails for convenient VCC and GND distribution
- Center channel suitable for standard DIP ICs
- Solder-free circuit prototyping
- Spring-loaded metal contacts for reliable connections
- Self-adhesive backing for mounting
- Interlocking design allows multiple breadboards to be connected
- Compatible with Arduino, Raspberry Pi, ESP32 and other development boards
- Reusable for repeated prototyping
MB102 830 Point Solderless Breadboard is a full-size reusable prototyping board designed for building and testing electronic circuits without soldering. It provides 830 tie points arranged on a standard 2.54 mm (0.1 inch) grid, making it suitable for common through-hole electronic components and DIP ICs.
The breadboard features a central terminal area with interconnected groups of five holes and separate power distribution rails along the sides. The center gap allows DIP ICs to be positioned across the two electrically separated sections.
It is ideal for Arduino projects, Raspberry Pi projects, ESP32 development, robotics, IoT projects, sensor circuits, educational experiments and general electronics prototyping.
Since no soldering is required, components and jumper wires can be inserted, removed and rearranged easily during circuit development.
PACKAGE INCLUDES:
- 1 × MB102 830 Point Solderless Breadboard
| Shipping Weight | 85 g |
|---|
- Arduino prototyping
- Raspberry Pi projects
- ESP32 projects
- IoT projects
- Robotics projects
- Sensor circuit testing
- LED circuits
- 555 timer circuits
- Transistor circuits
- Op-amp circuits
- Digital logic experiments
- Microcontroller development
- Electronic circuit testing
- STEM education
- Engineering laboratory experiments
- DIY electronics projects
- Rapid circuit prototyping
| Parameter | Specification |
|---|---|
| Product Type | Solderless Breadboard |
| Model | MB102 / MB-102 |
| Total Tie Points | 830 |
| Main Terminal Points | 630 |
| Power Distribution Points | 200 |
| Power Rails | 4 |
| Hole Pitch | 2.54 mm / 0.1 inch |
| Main Area | 63 Rows |
| Center Gap | DIP IC compatible |
| Compatible Wire | Approx. 20–29 AWG |
| Body Material | ABS Plastic |
| Contact Material | Nickel-plated / phosphor-bronze spring contacts* |
| Mounting | Self-Adhesive Backing |
| Interlocking | Yes |
| Dimensions | Approx. 165 × 55 × 9 mm |
| Weight | Approx. 84–85 g* |
| Operation | Solderless |
| Reusable | Yes |

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