MB102 830 Point Solderless Breadboard

  • 830 tie-point solderless breadboard
  • Standard 2.54 mm (0.1 inch) pitch
  • 630 tie points in the main terminal area
  • 200 tie points in power distribution rails
  • 4 power rails for convenient VCC and GND distribution
  • Center channel suitable for standard DIP ICs
  • Solder-free circuit prototyping
  • Spring-loaded metal contacts for reliable connections
  • Self-adhesive backing for mounting
  • Interlocking design allows multiple breadboards to be connected
  • Compatible with Arduino, Raspberry Pi, ESP32 and other development boards
  • Reusable for repeated prototyping
Description

MB102 830 Point Solderless Breadboard is a full-size reusable prototyping board designed for building and testing electronic circuits without soldering. It provides 830 tie points arranged on a standard 2.54 mm (0.1 inch) grid, making it suitable for common through-hole electronic components and DIP ICs.

The breadboard features a central terminal area with interconnected groups of five holes and separate power distribution rails along the sides. The center gap allows DIP ICs to be positioned across the two electrically separated sections.

It is ideal for Arduino projects, Raspberry Pi projects, ESP32 development, robotics, IoT projects, sensor circuits, educational experiments and general electronics prototyping.

Since no soldering is required, components and jumper wires can be inserted, removed and rearranged easily during circuit development.


PACKAGE INCLUDES:
  • 1 × MB102 830 Point Solderless Breadboard
Additional information
Shipping Weight85 g
Reviews (0)

Reviews

There are no reviews yet.

Be the first to review “MB102 830 Point Solderless Breadboard”

Your email address will not be published. Required fields are marked *

Applications
  • Arduino prototyping
  • Raspberry Pi projects
  • ESP32 projects
  • IoT projects
  • Robotics projects
  • Sensor circuit testing
  • LED circuits
  • 555 timer circuits
  • Transistor circuits
  • Op-amp circuits
  • Digital logic experiments
  • Microcontroller development
  • Electronic circuit testing
  • STEM education
  • Engineering laboratory experiments
  • DIY electronics projects
  • Rapid circuit prototyping
TECHNICAL SPECIFICATIONS
Parameter Specification
Product Type Solderless Breadboard
Model MB102 / MB-102
Total Tie Points 830
Main Terminal Points 630
Power Distribution Points 200
Power Rails 4
Hole Pitch 2.54 mm / 0.1 inch
Main Area 63 Rows
Center Gap DIP IC compatible
Compatible Wire Approx. 20–29 AWG
Body Material ABS Plastic
Contact Material Nickel-plated / phosphor-bronze spring contacts*
Mounting Self-Adhesive Backing
Interlocking Yes
Dimensions Approx. 165 × 55 × 9 mm
Weight Approx. 84–85 g*
Operation Solderless
Reusable Yes